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ProLink Universal Adhesive 8th Generation (Selective Etch) 5ml - Silmet - Expiration Date 10.2025


ProLink Universal Adhesive 8th Generation (Selective Etch) 5ml - Silmet - Expiration Date 10.2025

SKU : 104-1505UN-Short-Dated-a


ProLink Universal is an 8th-generation light-cure universal dental adhesive that combines etching, priming, and bonding in one bottle. It is an Ethanol/water-based adhesive engineered for use for both direct and indirect restoratives, flexible for use with all etching techniques, and is compatible with self or dual-cure composite and resin-based cement without an additional activator. Prolink universal is a new addition to the Prolink line of adhesives. Over the last 12 years, Silmet R&D gained knowledge and experience to overcome all challenges and develop Prolink Universal to perfection.

Contains: (1) 5ml Bottle

Advantages: Compatible with the light-cured, self-cured, and dual-cured cement material. Compatible with total-etch, self-etch, and selective-etch. 8-generation adhesives do not require pretreatment. One bottle, no separate activator needed.

4th Quarter Promotion (ends 12.31.24)

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Manufacturer: Silmet

SKU: 104-1505UN-Short-Dated-a

ProLink Universal Adhesive 8th Generation (Selective Etch) 5ml - Silmet - Expiration Date 10.2025

ProLink Universal is an 8th-generation light-cure universal dental adhesive that combines etching, priming, and bonding in one bottle. It is an Ethanol/water-based adhesive engineered for use for both direct and indirect restoratives, flexible for use with all etching techniques, and is compatible with self or dual-cure composite and resin-based cement without an additional activator. ProLink universal is a new addition to the Prolink line of adhesives. Over the last 12 years, Silmet R&D gained knowledge and experience to overcome all challenges and develop Prolink Universal to perfection.

Features & Benefits

• All in One / Single bottle - Minimal technique sensitivity.
• Total Universatility - Suitable for direct and indirect restoratives in all cure modes and any etching techniques
• Contains MDP and 4-MET - Forms a better double chemical adhesion
• Moisture and Humidity Tolerant - Improves the bond performance under variable humidity conditions and deep dentin
• Low film thickness
• Low Acidity

ProLink Universal is compatible with self or dual-cure composite and resin-based cements without an additional activator.

Properties

Shear Bond Strength (MPa)_> 10MPa
Film Thickness_<10
Acidity (pH)_2.8
Compatible with halogen light_Yes
Compatible with Plasma ark light lamp_Yes
Compatible with LED_Yes
Curing Time_5-20 seconds depending on light curing unit